The Process The patented MPT back metal separation process cleaves the back metal in the streets along the edges of each die. During the pick-and-place operation, the back metal in the streets stays on the tape while the die are removed. Unlike some other back metal processes that require transferring wafers to other tapes and frames, the wafers stay mounted on the same tape and frame used for plasma dicing. Process Time: 3 min. to 12 min./wafer depending on the die size and the back metal characteristics. Typical yield: Better that 99.9% through pick-and-place.